| 摘要 |
<p>PURPOSE:To enable continuous manufacture and inspection of ICs by using a chip carrier by conveying sealers of the state mounted on a positioning jig and contacting a probe to the electrode on the back surface of a substrate to measure the characteristics. CONSTITUTION:A sealer 17 completely sealed is mounted on a positioning jig 4 for sealing a cap 14 on a chip carrier substrate 9 in the state that the cap 14 is disposed at the lower side, a probe 19 is contacted with the electrode 18 on the back surface of the substrate 9 to measure the characteristics, the sealer 17 is automatically conveyed in the state placed on the jig 4, thereby continuously measuring the electric characteristics. A series of steps such as die bonding, wire bonding, sealing of the cap 14, checking the characteristics, sealing, and burning- in are continuously performed with the jig of a pallet 1 or the like formed with a container 2 for containing series of the substrate 9 of the chip carrier at the prescribed interval.</p> |
