发明名称 MOUNTING MECHANISM OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To make the mounting of a semiconductor device is simpler by providing compression nuts and fitting holes. CONSTITUTION:Compression nuts 21 and holes or notches 6 other than the nuts 21 for mounting a semiconductor device to a fin plate 31 for mounting the semiconductor device. For one form of mounting the holes 6 are used and for another form the nuts 21 are used.</p>
申请公布号 JPS57199246(A) 申请公布日期 1982.12.07
申请号 JP19810085251 申请日期 1981.06.01
申请人 MITSUBISHI DENKI KK 发明人 KAMISHIMA KUNITAKA
分类号 H01L23/32;H05K7/04 主分类号 H01L23/32
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