ARRANGEMENT FOR POTENTIAL-INDEPENDENT HEAT DISSIPATION

摘要

An arrangement is proposed for heat dissipation of the heat losses produced in electrical and electronic components. The active and passive components, in particular thin-film resistors, are in this case arranged or accommodated on a ceramic substrate (1). The ceramic substrate (1) is combined with a heat-dissipation panel (3), in a potential-independent manner, via a resilient package of individual straps (2), into a module, in particular a switch module for power-semiconductor components.