发明名称 MANUFACTURE OF SURFACE PLATE STRUCTURE
摘要 PURPOSE:To prevent any generation of cracks which might be developed in the vicinity of a penetrating hole, which is provided on a face plate, by making the diameter of the said penetrating hole smaller than that of a concave part, which is provided at the end of a heating tip for the purpose of packing a soldering glass into it. CONSTITUTION:After a penetrating hole 1a is provided in the peripheral part of a face plate 1, a signal producing electrode 2 is inserted into the hole 1a so as to make the electrode 2 to be held temporarily. Next, a heated tip 7 is placed above the hole 1a, and a given amount of a soldering glass 3 is packed into a concave part 7a provided at the end of the tip 7. Following that, the circumference of the hole 1a is covered with a mask 8, the tip 7 is moved down, and the soldering glass 3 is packed into a space G while applying ultrasonic waves to the space G so as to make the electrode 2 to be stuck in the hole 1a. Here, the diameter of the concave part 7a is made larger than that of the hole 1a. By the means mentioned above, since the soldering glass 3 is satisfactorily packed into the space G, difference in thermal expansion which is developed in the vicinity of the hole 1a is reduced, and the generation of cracks is decreased.
申请公布号 JPS57118354(A) 申请公布日期 1982.07.23
申请号 JP19810003077 申请日期 1981.01.14
申请人 HITACHI SEISAKUSHO KK 发明人 MARUYAMA AKIO;AIZAWA SHIROU
分类号 H01J29/86;H01J29/90;(IPC1-7):01J29/90 主分类号 H01J29/86
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