| 摘要 |
<p>PURPOSE:To cool the semiconductor element with high efficiency only at the one side by fast sticking a metallic foil having excellent heat conduction onto a surface having smaller thermal resistance of a semiconductor plate and projecting a lower surface of the semiconductor plate to a section lower than a lower end of a side surface of an airtight vessel. CONSTITUTION:A Mo plate 22 is attached on the back of the Si plate 21 and mechanical strength is improved, and a temperature is compensated. A copper block 24 is mounted onto an upper surface of the element 23, and arranged into the cylindrical ceramic 25. The copper foil 26 is fitted to the bottom of the cylinder 25 and used an an electrode, and the bottom 27 of the element 23 is projected more than the lower end 28 of the side surface of the vessel. Accordingly, the copper block is unnecessitated at the lower end. According to this constitution, the flat type element having small thermal resistance is obtained.</p> |
