| 摘要 |
PURPOSE:To miniaturize the lead, to increase the degree of integration and to connect the semiconductor device with high accuracy by mounting a plurality of stress patterns to the lead for connection as cushion sections and making the shape symmetric in the longitudinal direction of the lead. CONSTITUTION:The metallic leads digitally projected into a window hole, the surface thereof is coated with gold, silver or the like, are placed onto an electric insulating film 3, and the two framed stress relaxing patterns are connected continuously as the cushion sections. Accordingly, the spaces of the leads can be narrowed, the degree of integration of the leads is increased, displacement is not generated, and the leads can connect the semiconductor device with high accuracy. |
