| 摘要 |
<p>PURPOSE:To reduce cost by the abolition of a solder bump for an IC chip, and to stabilize the position of the height of the IC chip to a circuit substrate by forming a protrusion monolithic-molded to the circuit substrate shaped by molding a plastic resin. CONSTITUTION:Conductive paste is screen-printed onto a circuit substrate 5 formed by molding a plastic resin to which a protrusion 5a is shaped through monolithic molding, and a wiring pattern 5c is formed up to the upper surface section 5b of the protrusion 5a. An IC chip 6 is loaded onto the circuit substrate 5 so that electrode pads 6a for the IC chip 6 and the protrusion 5a for the circuit substrate 5 correspond, and bonded through heating up to a temperature where a thermosetting resin material included in conductive paste is cured, and electrical continuity is obtained between the IC chip 6 and the wiring pattern 5c on the protrusions 5a for the circuit substrate 5. Accordingly, a solder bump is unnecessitated and cost is reduced, and the height of the IC chip is kept constant and a short-circuit between a substrate wiring pattern and the lower surface of the IC chip is prevented.</p> |
