| 摘要 |
PURPOSE:To perform uniform brazing and improve reliability, by a method wherein in chip bonding, the collet axis angle is corrected according to the inclination of the chip band surface of a package so that said chip band surface and the chip lower surface are held in parallel to each other. CONSTITUTION:Being clamped between leg parts 1 and 1' of a collet comprising a tweezer mechanism, a chip 2 is carried to above a chip band 5 of a package 4 and lowered so as to be mounted thereon. In this case, by means of a foreign substance 8 placed between a holder 7 and the package 4, the collet axis Y-Y' is inclined to the vertical plane at a given angle theta. With the collet leg parts opened, the collet is further lowered, and when the chip 2 abuts on the band, the collet axis is corrected so as to be perpendicular to the band surface. With the correction angle theta maintained, the chip is clamped again and slid contacting with the band surface so as to be scrubbed. Thereby, it is possible to perform uniform brazing without damaging the edge portions. |
