| 摘要 |
Organosilicon high molecular weight compounds containing silicon and carbon as the main skeleton components and organosilicon high molecular weight compounds containing silicon and carbon as the main skeleton components and 0.01-20% by weight of at least one foreign element other than silicon, carbon, hydrogen and oxygen have a number average molecular weight of 500-30,000, and intrinsic viscosity of 0.01-1.50 and a silicon carbide residual amount of not less than 40% by weight after baked at a temperature of 800 DEG -1,500 DEG C. in a non-oxidizing atmosphere and are useful for the production of silicon carbide moldings. |
