Conditioning of polyamides for electroless plating

摘要

Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an aqueous acid etch solution. The aqueous acid etch solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloroacetic acid.