| 摘要 |
PURPOSE:To prevent damages, such as the breaking, cracking, etc. of a semiconductor chip by coating the peripheral section of the semiconductor chip with a protective film such as an insulating film consisting of polyimide, an silicon nitride film, epoxy resin, etc. CONSTITUTION:A protective film 7 coated for protecting the peripheral section 4 of a semiconductor chip 1 is formed to the peripheral section 4. An insulating film consisting of polyimide, an silicon nitride film, epoxy resin, etc. is used as the protective film 7. A shock to the semiconductor chip 1 is relaxed on the handling of the semiconductor chip 1 in the semiconductor chip 1, the peripheral section 4 thereof is protected by the protective film 7, thus reducing the generation of a breaking 5, a crack 6, etc. due to handling. |
