| 摘要 |
<p>PURPOSE:To eliminate the disconnection at the connection part between an electronic part element and an external substrate by increasing the thickness of the outer lead for connecting the element to the substrate thicker than an inner lead. CONSTITUTION:An inner lead 15A is connected to an electronic part element 2, an outer lead 15B is connected to an external substrate 4, and the thickness of the connecting part of the outer lead is formed approximately double of the inner lead. Since the outer lead is thus thick, no problem such as bending, disconnection or the like occurs, and it can be readily handled. Since it is not necessary to form a bump at the element, the number of steps can be reduced, the yield can be improved, and the cost can also be reduced.</p> |
