发明名称 CUTTING METHOD FOR THIN FILM BY LASER BEAM
摘要 PURPOSE:To cut thin films continuously and accurately by converging laser beam optically on the thin film. CONSTITUTION:When laser beam generated by a laser generating device is condensed optically on a running thin film, the film is cut by melting by the energy of laser beam and the end face becomes rounded properly and does not tear, and continuous cutting is possible semipermanently by maintining the energy of laser beam constant. The film is made of either of thermoplastic resin film, thermosetting resin film or metallic foil. In the case of films, gaseous carbon dioxide laser beam is preferable and in the case of thin metallic films ruby laser beam or yttrium aluminum garnet laser beam is desirable. It is preferable to use a semiconductor lens to condense the laser beam emitted from the oscillator.
申请公布号 JPS56151189(A) 申请公布日期 1981.11.24
申请号 JP19800054560 申请日期 1980.04.23
申请人 发明人
分类号 B23K26/00;B23K26/40 主分类号 B23K26/00
代理机构 代理人
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