| 摘要 |
PURPOSE:To obtain a microminiature circuit pattern by covering the first conductive film on a substrate, plating the second conductive film pattern thereon, then covering a protective film on the upper and side surfaces of the second film and etching the first film. CONSTITUTION:The first conductor 2 is formed on titanium-palladium alloy or the like on a substrate 1 made of alumina, glass or the like. Then, a resist 3 is covered thereon, and a pattern is formed thereon by an exposure development. Subsequently, the second conductor 4 is formed of copper, gold or the like by an elctric plating. Further, the resist 3 is thermally shrinked to form gaps 6, and a protective film 5 is formed on the gap 6 and on the second conductor 4. The film 5 may be any which can endure against the etchant of the first conductor 2, and preferably be metal. Eventually, the resist 3 is removed, the film 5 is used as a mask to etch the first conductor 2, and a circuit pattern is obtained. Since the film 5 exists thereon, it can prevent the sidewise etching at the time of etching. |
