| 摘要 |
PURPOSE:To facilitate replacement of a semiconductor element by a method wherein a terminal block connected with a conductor for connection is formed to retain a vaporizer and connected by a flexible wire in a cooling device by boiling consisting of the vaporizer contacting with the semiconductor element, a condenser and a heat transferring pipe. CONSTITUTION:The vaporizer 1 wherein cooling medium 9 is enclosed and the semiconductor element are laminated alternately and made to contact with each other under pressure. The vaporizer is communicated with the condenser 3 by the heat transferring pipe 11. By an insulated hollow pipe 5 inserted through the heat transferring pipe, the cooling medium 9 which is vaporized, condensed and liquefied is made to circulate to the bottom part of the vaporizer, cooling the element. The terminal block 12, retaining the vaporizer, is connected by the flexible wire 11 and, on the other hand, is also connected with the conductor 6 for connection. By this constitution, the replacement of the semiconductor element is facilitated, while bar wiring as well as miniaturization of the device is made possible. |
