| 摘要 |
PURPOSE:To reduce the density of a lead pattern on a film by a method wherein an outer bonding protion of a lead wire is arranged on the front and rear surfaces of the film so that cross wiring is made possible. CONSTITUTION:An outer bonding portion 6 of a lead wire 4 is introduced onto the front and rear surfaces of a film 1 and made to protrude from the edge of the film. An inner bonding portion 5 may be led onto the surfaces. Therefore, the density of a wiring pattern can be halved, while its packaging density is greatly improved. |
