| 摘要 |
PURPOSE:To evaluate the suitability of bonding simply and quickly by a method wherein an Au film is evaporated on an Al or Al alloy surface, the whole body is thermally treated and a ratio of a formed intermetallic compound to an area to be treated is utilized. CONSTITUTION:An Au film with 1000Angstrom -1mu thickness is evaporated on an Al or Al alloy surface. The reproducibility of evaluation is poor when the thickness is 1000Angstrom or less, and the recognition of the formation of the next intermetallic compound is difficult when the thickness is 1mu or more. When the whole body is treated for two min or more at 350-500 deg.C, a sufficient intermetallic compound is formed. Products can easily be determined by means of an optical microscope. When an area ratio of an Al-Au reaction is 80% or more, possibility of the generation of faulty wire bonding is naught. Thus, the Al-Au intermetallic compound is formed and only not less than 80% formed area may be necessary to be line-joined in order to obtain a device having high reliability. Such a method ensures extremely excellent reproducibility, and the surface condition of Al, an Au alloy or Au, particularly, adhesive property with a metallic member, can quickly be evaluated simply. |
