| 摘要 |
A ceramic substrate, suitable for use as a circuit substrate on which integrated circuit chips are bonded, which consists essentially of, based on the weight of the substrate, 0.5 DIFFERENCE 5.0% by weight of MgO, and 95.0 DIFFERENCE 99.5% by weight of the total of Al2O3 and SiO2, the proportion of the Al2O3 to the SiO2 being in the range from 50:50 to 80:20 by weight. |
