REPLACEMENT OF SEMICONDUCTOR CHIP CARRIER

摘要

PURPOSE:To accomplish an efficient replacement of a chip carrier by selectively adding a radiant heat thereto through a window in a heat shielding plate following the preheating of a mother board. CONSTITUTION:A mother board 1 in N2 is preheated on a heating plate 8 up to about 150 deg.C. Subsequently, an infrared lamp 9 irradiates it placed on a heat shielding plate 5 and after a solder on an electrode 4 of a chip carrier is solvent in a square column, the chip carrier is removed and a new one is inserted and fused. This eliminates repositioning and rechecking thereby enabling highly reliable replacement along with extremely limited man-hours.