| 摘要 |
<p>A semiconductor chip with its electrodes 22 connected to corresponding electrodes 25 on a circuit board 24 by solder columns 23 is supported by solder spacers 33 formed on isolated metallised pads 34 on the circuit board, the spacers not wetting the chip. The arrangement is produced by forming solder bumps on the electrodes of the chip and circuit board and applying to the isolated pads layers of a solder of higher melting point and of a thickness less than the combined heights of the solder bumps. The chip is positioned on the circuit board with the solder bumps in contact and the temperature raised. The solder bumps melt and merge to form the columns 23 and the spacers then melt, surface tension causing the chip to be lifted so that the solder columns 23 are drawn into a cylindrical or hour-glass shape. Since the spacers do not wet the surface of the chip no lateral or rotational forces which might displace the chip are generated. <IMAGE></p> |
