发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To ensure speedy control of chip temperature by providing a circuit block and a heating device in one chip. CONSTITUTION:When the terminals 11 and 12 placed in one chip are supplied with power, a heating device 1 heats to raise the temperature of a chip 3 and a circuit block 2. Thereafter, high temperature characteristic can be obtained by measuring electric characteristic. Thereby, the change in characteristics due to that in temperature can be measured without external heating in a short time. The breakdown voltage of a Zener diode used as the devide 1 is selected higher than the operation voltage of the block 2 and the voltage resistance value of the block 2 is made higher than the breakdown voltage value of the diode. Thereby, both the power supply for heating and the actual operation of the block 2 are not obstructed.
申请公布号 JPS5649559(A) 申请公布日期 1981.05.06
申请号 JP19790125962 申请日期 1979.09.29
申请人 NIPPON ELECTRIC CO 发明人 ONO YOSHIHIDE;YAZAWA AKIRA
分类号 H01L21/822;H01L21/66;H01L27/02;H01L27/04 主分类号 H01L21/822
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