| 摘要 |
<p>An apparatus for manufacturing a printed circuit board includes a processing mechanism or frame having means on a portion thereof for supporting a slave board and a circuit board on the slave board during installation of selected electrical components on the circuit board. Leads of the electrical components depend from a lower surface of the slave board and each extend through a respective one of a plurality of lead apertures extending through the circuit board and through suitable apertures in the slave board. A guide assembly has therein the slave board and the circuit board with the electrical components thereon and engages guide members on the frame and moves therealong and above lead cutting members operative to cut the leads depending below the lower surface of the slave board at a predetermined spacing from the slave board lower surface. The processing mechanism or frame includes means thereon for soldering the trimmed leads to a lower surface of the circuit board after the slave board has been separated therefrom.</p> |
