发明名称 ULTRASONIC PREESOLDERING METHOD AND APPARATUS THEREOF
摘要 PURPOSE:To obtain the pre-soldering of high quality without requiring flux by contacting the end of an ultrasonic horn to the solder surface melted on the metal surface to be pre-soldered and vibrating the same in such a manner that the ultrasonic horn does not detach from the liquid surface, in a nonoxidative atmosphere. CONSTITUTION:Inert gas 14 such as N2 is introduced into the box 15 which contains an ultrasonic horn 13 and the metal substrate 1 to be soldered. In this atmosphere, the metal substrate 1 to be soldered, on which a solder frame 12 is placed, is placed on a heating plate 6 and the solder foil is melted. next, the ultrasonic horn 13 whose end has been heated to above the melting point of the solder foil by a heater 16 is contacted to the molten solder by a manual elevating device 18 and the ultrasonic horn is vibrated by an ultrasonic oscillator 19. This causes the solder foil 12 and the metal substrate 1 to be soldered to alloy and the soldering to be thereby accomplished.
申请公布号 JPS55136562(A) 申请公布日期 1980.10.24
申请号 JP19790042063 申请日期 1979.04.09
申请人 发明人
分类号 H05K3/34;B23K1/00;B23K1/06;B23K1/20;H01L21/52;H01L21/58 主分类号 H05K3/34
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