| 摘要 |
PURPOSE:To enable automatic bonding by deforming its metalized patterns according to the dimensions of a semiconductor element and an output terminals pad, on an insulating board which electrically insulates the element's electrode and a heat-sink. CONSTITUTION:A ceramic substrate 2 is bonded to a heat-sink 1, while chip parts 4, 5 and a wire-bonding pad 6 are soldered thereon. An insulating board 20 having its both surfaces metalized is soldered to the heat-sink 1 in a transistor portion 30. Further, a molybdenum sheet 8 and a transistor 9 are soldered thereto is series. A metalized face 22 as well as a metalized face 21 for pad 7 are formed in patterns corresponding to the respective dimension, being made in size-pattern. Thus, the positioning of the transistor chip 9 and the pad 7 to be solderes is facilitated. |
