| 摘要 |
PURPOSE:To obtain the captioned product which is suited for electric wiring and immersion plating and contains phosphorus of less oxides by compounding Sn and Pb at desired ratios then charging the deoxidizer containing phosphorus copper braze and phosphorus while melting the same thereby melting and mixing phosphorus in alloy-form. CONSTITUTION:After Sn and Pb are compounded at desired ratios, the deoxidizer containing phosphorus copper braze and phosphorus is charged thereto while these are being melted, so that phosphorus is melted and mixed. At this time, the charging amount of the phosphorus copper braze and deoxidizer is so determined that the active solder containing phosphorus of a desired ratio is obtained, by beforehand calculating the total amount of the phosphorus to be contained in these. According to this method, the phosphorus is activated to prevent the oxidation of the solder surface when melted and yet it prevents the oxidation in the alloy or on its surface and it rapidly reduces the oxide products in the alloy and on its surface and therefore the amount of the formation of oxides is considerably reduced as compared to conventioanl products. |
