发明名称 |
Ion plating apparatus |
摘要 |
An ion plating apparatus having a plurality of vapor sources for supplying the vapors of evaporating materials, the particles of the vapors being ionized and accelerated by an electric field to impinge on the surface of a substrate so as to form a film of the evaporating materials thereon is disclosed. An ionization chamber common to a plurality of the vapor sources, the ionization chamber being composed of parallel filaments for emitting electrons is also disclosed. Grid-shaped electron-accelerating electrodes are provided between the filaments so that the vapors of the evaporating materials pass between them, and the electron-accelerating electrodes kept at a positive potential with respect to the filaments thereby to ionize the vapors of the evaporating materials.
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申请公布号 |
US4213844(A) |
申请公布日期 |
1980.07.22 |
申请号 |
US19780968817 |
申请日期 |
1978.12.12 |
申请人 |
FUTABA DENSHI KOGYO K.K. |
发明人 |
MORIMOTO, KIYOSHI;TAKAGI, TOSHINORI;WATANABE, HIROSHI |
分类号 |
H01J37/317;C23C14/32;C30B23/08;(IPC1-7):C23C15/00 |
主分类号 |
H01J37/317 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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