| 摘要 |
<p>PURPOSE:To facilitate the manufacture and maintenance by securing a simple separation between the cooling part and the integrated circuit part mounted with a high termal adhesion performance. CONSTITUTION:The following component parts are provided: integrated circuit mounting substrate 10; integrated circuit mounting case 11 which can conatin 9 sheets of substrate 10; cooling part case 12; partition frame 13 attached to one side of case 12; silicone rubber bag 14 attached into each partition; and hinge 15 which connects the above two cases together. To drive such device, the two cases are closed with the silicone oil injected into bag 14. Then the heat generated from the integrated circuit on substrate 10 is conveyed to the cooling plate of the opposite side via the silicone oil convecting in bag 14 and then absorbed into the cooling water in the cooling pipe.</p> |
