| 摘要 |
The electroless plating soln. contains Cu salt, triethanolamine(I), alkali, formaldehyde, selenocynate alkali metal salt, and cynide compd. The rate of Cu deposition from the soln. at room temp. is 5-10μlhr. Thus, the Cu deposition rate to a plastic substrate from a mixt. of CuSO4 0.04, I 0.5, and HCHO 0.5 mol/l with 50ppm NaCN and 0.75ppm Na selenocynate at 30≦̸C was 10μ/hr, compared with 1μ/hr for conventional compns.
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