| 摘要 |
PURPOSE:To preferably adhere a semiconductor substrate to a support without special layer by using molten solder retained in active state in an electric furnace of inactive or reducing atmosphere. CONSTITUTION:A substrate support 11 fed into an electric furnace cover 2 is heated as it is moved to become at maximum temperature under a solder dropping unit 6. Suitable amount of solder is dropped at this to feed the support 11 at one pitch. The solder is expanded in circular shape to reach the support in preferable state. It is then fed under a vacuum pincette 9, placed with a substrate 10 thereon, to adhere the substrate to the support at feeding step, and fed out of the furnace. In the meantime, inert or reducing gas is supplied over the molten solder liquid surface through holes 3 to 5 to allow the solder to exhibit active surface state to be thus very preferably adhered. |
