发明名称
摘要 The which edge is embedded in an insulating intermediate layer which affects the electric charge in adjacent surface region of the semiconductor substrate. The electrode is mounted on an oxide film (4) on the substrate (2). - The surface part of the substrate surrounded by the intermediate layer (6) is covered by the metal electrode (10). The intermediate layer covers also the oxide film whose surface charge is sufficiently increased by suitable pretreatment of the substrate, to compensate the charge carrier enrichment in the substrate semiconductor layer adjacent to the intermediate layer.
申请公布号 DE2128488(C3) 申请公布日期 1980.01.17
申请号 DE19712128488 申请日期 1971.06.08
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN 发明人 CZULIUS, WERNER, DIPL.-PHYS. DR., 8520 ERLANGEN;EBERLEIN, REINHOLD, 8521 TENNENLOHE;GLASOW, PETER, DIPL.-PHYS., 8521 BUBENREUTH;SPILLEKOTHEN, HANS-GERD, 5060 BENSBERG
分类号 H01L23/29;H01L31/00;(IPC1-7):H01L31/10;H01L31/18 主分类号 H01L23/29
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