发明名称 ELECTRONIC PARTS AND ITS MANUFACTURE
摘要 PURPOSE:To connect gold wires without breaking them by preventing crystal particles of fine gold wire from expanding and becoming coarse caused by recrystallization and by reducing the separation of impurities. CONSTITUTION:Crystals of fine gold wires become coarse and brittle, thus breaking easily when crystals are heated by the radiant heat of hydrogen flames while forming gold balls. The diameter of crystal particle is changed by the heating temperature and there is a relationship between the diameter of crystal partical and tensile strength of gold wire. Then, make a gold ball by controlling the heating temperature in such a manner that the means diameter of each crystal particle ranging from the end of fine gold wire to the portion 0.3 mm from the end is kept less than 15mum and connent the ball to the element electrode and, then, to the external load, thus enabling to prevent wires from breaking.
申请公布号 JPS5498174(A) 申请公布日期 1979.08.02
申请号 JP19780004355 申请日期 1978.01.20
申请人 HITACHI LTD;TANAKA ELECTRONICS IND 发明人 KOBAYASHI YOSHIHIKO;SHIMATA TSUTOMU;HAYASHI SHIYOUZOU
分类号 B23K20/00;H01L21/60;H01L21/603 主分类号 B23K20/00
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