发明名称 PARTIALLY PLATING METHOD
摘要 PURPOSE:To easily carry out cheap partial plating of a product even if the shape of the parts to be plated is complicated, by marking the shape on the product surface by printing, etc.; forming a plating resist film on other parts; removing the marking material; and plating the removed parts. CONSTITUTION:The surface of product 10 to be plated undergoes numerical marking 11 with ink, and plating resist film 12 is formed on other parts. After removing marking 11, predetermined plating 13 is carried out, and finally film 12 is removed. By this method letters, spots, figures, drawings, etc. can be partially plated at a lower cost than that of a photoresist method.
申请公布号 JPS5483634(A) 申请公布日期 1979.07.03
申请号 JP19770151456 申请日期 1977.12.15
申请人 HITACHI CABLE 发明人 ONDA MAMORU
分类号 C23C16/04;C23C2/02;C23C18/31;C23F1/00;C25D5/02;C25F3/14 主分类号 C23C16/04
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