| 摘要 |
<p>Printed circuit boards are produced by applying a film of flux over the board, conductor tracks and holes, followed by a foil of solder. The assembly is laid face down on a plate of hard foam and the connecting wires are pushed through the holes. Swamp or dip soldering completes the joints after the foam plate has been removed. This simplifies the prodn. and holds the modules by their connecting wires without extra retainers or wire bends. Undesirable overlapping during the soldering operation is eliminated. No prior timing of the tracks is needed.</p> |
