发明名称 BATH FOR THE ELECTRODEPOSITION OF GOLD
摘要 <p>A cyanide-free bath for the electrodeposition of gold includes a conductive salt such as the ammonium or alkali metal salt of an inorganic or weak organic acid, e.g., sulphuric, sulphurous, carbonic, boric, sulphamic, acetic or citric acid; and gold in the form of a thiosulphato-complex in a concentration of 3 to 30 g/litre, the complex being sodium dithiosulphatoaurate (I) or sodium heptathiosulphato-aurate (I). The bath may also contain, as a reducing agent, an alkali metal nitrite or sulphite, and, as a buffer or pH regulator, sodium borate, potassium metabisulphite or a mixture of boric acid and ethylene glycol.</p>
申请公布号 CA1053174(A) 申请公布日期 1979.04.24
申请号 CA19750235878 申请日期 1975.09.19
申请人 SCHERING AKTIENGESELLSCHAFT 发明人 LUDWIG, ROLF;CULJKOVIC, JOSIF
分类号 C25D3/48;(IPC1-7):25D3/48 主分类号 C25D3/48
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