INTEGRIERTES SCHALTUNGSPLAETTCHEN UND VERBINDUNGSSUBSTRAT FUER SOLCHE PLAETTCHEN SOWIE VERFAHREN ZU DEREN HERSTELLUNG

摘要

A chip 6 forming an integrated electrical circuit has a working face 6a provided with circuit components connected to terminals situated at the periphery of the working face 6a which is entirely covered with a surface layer 9 of insulating resin e.g. silicone resin, which is resilient or in the form of a solidified gel and which does not extend beyond the boundaries 10 of the working face 6a, and the tangent to the resin surface at the periphery makes an angle of from 25 DEG -45 DEG with the working face 6a.