发明名称 RESIN SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To avoid the short occurrence between electrodes caused by the diffused solder material due to the heat generation caused by the overcurrent, by forming a concavity to the electrode plate to be welded to the main electrode of the pellet as if the gate electrode were enclosed by the concavity.
申请公布号 JPS5431276(A) 申请公布日期 1979.03.08
申请号 JP19770097266 申请日期 1977.08.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 ICHIMURA TAKAHIKO
分类号 H01L21/60;H01L23/28;H01L23/48;H01L25/00 主分类号 H01L21/60
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