首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
BONDING METHOD
摘要
申请公布号
JPS5420022(A)
申请公布日期
1979.02.15
申请号
JP19770085133
申请日期
1977.07.18
申请人
TOKYO SHIBAURA ELECTRIC CO
发明人
GOTOU EIZOU
分类号
C03C27/08;C03C27/00;C03C29/00
主分类号
C03C27/08
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Automated storage system with array of storage cells.
Process and system for recycling articles without any specific substantial value, for example a disposable container.
Process for the purification of cyclohexanone.
Curable resin composition.
Supporting device for railway rails.
Non-volatile DRAM cell.
Cable lead-through for EMI shielded cabinets.
Cord controlled window shades.
Thermal and acoustic insulating laminate.
High frequency electrical connector.
SIMPLIFIED SECURITY SYRINGE.
Information processing apparatus and information processing system.
BLOW-MOLDED PLASTIC VESSEL FOR LIQUID MEDICINE.
Refractory metal capped low resistivity metal conductor lines and vias.
Prostaglandin E receptors, their DNA and production.
Arrangement in mobile telecommunication systems for providing for an improved hand-over function.
Boring arm.
Auto-reset circuit with improved testability.
Contour restoration apparatus.
Semiconductor laser device.