| 摘要 |
<p>PURPOSE:To obtain a semiconductor device which can dispense with a die stage that induces cracks to a package, can be turned into a device of vertical surface mounting type, and mounted with two or more semiconductor chips. CONSTITUTION:A semiconductor chip 2 is supported by the sides of inner leads 4 through the intermediary of an insulating film 7 provided to its surface, and the chip 2 and other component parts are sealed up with resin (sealing resin 1), where two or more semiconductor chips 2 are provided making their rear sides confront each other (back to back) as separated from each other by a certain space. The inner leads 4 are made to extend over the surfaces of the semiconductor chips 2, and the gap between the semiconductor chips 2 is filled with sealing resin 1. Other component parts are composed of outer leads 5, wires 6, and spacers 8.</p> |
