SEMICONDUCTOR DEVICE, ITS MANUFACTURE, AND TAPE CARRIER

摘要

PURPOSE:To provide a semiconductor device on which multiple chips can be mounted in a high packing density, tape carrier used for the semiconductor device, and method for manufacturing the semiconductor device. CONSTITUTION:Multiple chips are mounted on a semiconductor device in a high density packaging manner by mounting a plurality of semiconductor elements (chips) 2A and 2B on the island 11 of a lead frame and connecting the inner leads 12 of the lead frame to the chips 2A and 2B by using the inner leads 32 and outer leads 33 of a tape carrier and the chips 2A and 2B with each other by using the connecting lead 34 of the tape carrier.