METAL-BASED PHOTONIC DEVICE PACKAGE MODULE AND PROCESS OF THE SAME

摘要

The metallic base optical device package module and manufacturing method thereof are provided to prevent the short between the bottom electrodes and to release effectively the generated heat of the optical device. The metal oxide layer(12) is formed on the metallic board(10) through the optional anode oxidation. The metallic board is formed into the sheet form. The mounting groove(14) is formed by performing the optional anode oxidation on the metal oxide layer. The optical device(16) is mounted in the mounting groove. The reflecting surface(20) is formed in the inner surface of the mounting groove. The luminous efficiency is maximized by using the reflecting surface.