| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic module capable of efficiently radiating heat generated from heating components.SOLUTION: An electronic module 1 is composed of a plurality of resin substrates, circuit conductors 5a, 5b, 5c, heating components 7a, 7b, an electronic component 9, and so on. The plurality of circuit conductors 5a, 5c, 5b are arranged on a heating component mounting substrate 3a, a side face substrate 3c, and a heating component counter side substrate 3b, respectively. The heating components 7a, 7b are arranged on the heating component mounting substrate 3a. The heating component 7a is brought into contact with the circuit conductor 5a on the heating component mounting substrate 3a. The circuit conductor 5c on the heating component counter side substrate 3b is brought into surface-contact with an upper surface of the heating component 7a. Namely, the heating component 7a is held between the circuit conductors 5a, 5c of the heating component mounting substrate 3a and the heating component counter side substrate 3b, and the circuit conductors 5a, 5c are thermally connected to the heating component 7a.SELECTED DRAWING: Figure 3 |
