| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device capable of preventing corrosion of a Ni alloy film in an electrode having a laminated structure of a Cu film and the Ni alloy film, and further preventing exfoliation between the Cu film and the Ni alloy film caused by a thermal change, while improving bond between the Ni alloy film and solder.SOLUTION: An electronic device includes: an electrode 10 having a base metal film 5 formed on a substrate 1, and a Ni alloy film 7 formed on the base metal film 5, and having a distribution in which the concentration of an element P or B of a reducer used for electroless plating is heightened stepwise in a vertical direction from a lower part to an upper part with respect to one surface of the substrate 1; and solder 11 bonded to the uppermost layer 7d of the Ni alloy film 7 of the electrode 10.SELECTED DRAWING: Figure 2 |
