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发明名称
ELECTRODE LEADDOUT METHOD
摘要
PURPOSE:To increase the adhesion strength of electrodes and simplify electrode leadout process by using the two bump electrodes on an IC pad having mutually intermeshing form and a protruding lead wire (finger) which can be fitted therein.
申请公布号
JPS5333060(A)
申请公布日期
1978.03.28
申请号
JP19760107413
申请日期
1976.09.08
申请人
发明人
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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