| 摘要 |
1503449 Semiconductor devices SIEMENS AG 29 July 1976 [1 Aug 1975] 31594/76 Heading H1K A contact pad 2 for a semiconductor device comprises a plurality of discrete elements 6, 7, 8 one of which, 8, is electrically connected, e.g. via track 3, to the semiconductor zone to which external contact is to be made and comprises a series of spaced elongate portions distributed throughout the pad. When a terminal lead, such as 5, is bonded to the pad 2 only a minor portion of the total area of the pad is thus capacitively coupled through the underlying insulating layer to the semiconductor substrate. Various pad configurations are possible, Fig. 1 showing one example. |
