Method and composition for plating palladium

摘要

This invention relates to the palladium plating of electrical parts, such as frames, pins, connectors and in general various types of electrical contacts. More particularly, this invention relates to a method and composition for high speed electroplating of uniform, bright palladium deposits over a wide operating current density range using a palladosammine chloride plating bath to which sodium sulfite has been added. The method is adapted for rack plating of parts having an irregular shaped configuration as well as those having a uniform configuration.