| 摘要 |
PROBLEM TO BE SOLVED: To enhance mechanical strength, narrow an electrode interval and enhance mount density by a method wherein a sub-substrate is interposed between two connectors from both sides. SOLUTION: A connector 14 comprises: a terminal 14a formed in a plurality of rectangular sections; and a resin part 14b molded with heat-resistant resin held by insulating the plurality of terminals 14a at specific intervals. A groove- like substrate engagement part 14c is provided in this resin part 14b. Both ends of a sub-substrate 11 to which parts are mounted on its both faces are inserted into the substrate engagement parts 14c, 14c of the connectors 14, 14. Thereafter, a space between a bonding pad 11b of the substrate 11 and the terminal 14a of the connector 14 is bonded at bonding points 15a, 15b by a wire 15. The substrate assembly that this terminal mounting is completed is mounted on a solder pattern 16a of a printed board 16 on which solder paste is applied, and by melting solder 17, a lower end of the connector 14 and a solder pattern 16a of the printed board 16 are melted and adhered.
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