GLASS SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To assure hermetic sealing by providing flange parts of an outside diameter larger than that of head parts leaving a fixed spacing from the head parts of the leads which have a larger coefficient of thermal expansion than silicon and glass and are covered with a film being nonadhesive to glass and enclosing the portions between the flange parts with sintered glass after securing a pellet to the head parts with low melting point brazing materials.