Shield lid interconnect package and method

摘要

An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

主权项

1. An electronic component package comprising:
a substrate comprising a first substrate surface, a second substrate surface opposite the first substrate surface, and side substrate surfaces extending between the first substrate surface and the second substrate surface; an electronic component mounted to the first substrate surface; a shield trace on the first substrate surface, the shield trace extending from a first of the side substrate surfaces toward a second of the side substrate surfaces while extending past the electronic component; a dielectric package body directly contacting and enclosing the electronic component and covering the first substrate surface around the electronic component, the package body comprising a principal body surface and outer side body surfaces extending from the principal body surface; and a shield lid interconnect for electrically coupling the shield trace to a shielding structure, the shield lid interconnect in direct contact with and extending through the package body between the first substrate surface and the principal body surface and coupled to the shield trace, where the shield lid interconnect is configured as an electromagnetic interference (EMI) shield.