发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To perform rapid positioning by forming two spot lights respectively suited to bonding positions of different sizes by means of a light projector which moves integrally with a tool for holding wire and projects light to the bonding surface.
申请公布号 JPS52127069(A) 申请公布日期 1977.10.25
申请号 JP19760043362 申请日期 1976.04.16
申请人 发明人
分类号 G05D3/12;G05D3/00;H01L21/60 主分类号 G05D3/12
代理机构 代理人
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