发明名称 Machine for processing and securing parallel lead electronic circuit elements to a printed circuit board
摘要 A machine for processing and securing parallel lead electronic circuit elements into lead receiving openings formed in a printed circuit board is provided. The machine includes a supply assembly for selectively supplying one group of a plurality of distinct groups of parallel lead electronic circuit elements, the supply assembly including a selecting sub-assembly for selecting one of the circuit elements from the selected group circuit elements to be supplied. A transfer assembly includes a chuck for receiving the supplied circuit elements and displacing same to a release position. An insert assembly is adapted to effect release of the circuit elements when the chuck is displaced to a release position and includes a holding sub-assembly for receiving each circuit element released by the chuck at the release position and a plunger sub-assembly adapted to engage the circuit elements at the release position and displace the circuit elements from the release position to an inserted position. A board handling assembly disposes the receiving openings in the printed board in alignment with the circuit elements so that the parallel leads each circuit element are received in the appropriate receiving openings when same are displaced to the inserted position.
申请公布号 US4054988(A) 申请公布日期 1977.10.25
申请号 US19760672944 申请日期 1976.04.02
申请人 TOKYO DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 MASUZIMA, SHO;TAKAHASHI, TETSUO;TAGUCHI, YOSHINOBU;FUJITA, HISASHI
分类号 B23P21/00;H05K13/04;(IPC1-7):H05K3/30 主分类号 B23P21/00
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